Strategies & Insight into the Advanced Class of Mobile Phones and the ICs that enable them

Report No: 1010

2009 was the year of Smartphone applications, with Apple’s leading App Store having reached 140,000 applications. All major O/S vendors have followed suit with larger OEMs such as Nokia...with its own Ovi initiative having completed a major upgrade during the year. Spearheaded by Apple, most major OEMs are similarly moving towards an integrated hardware, O/S, applications and services strategy.

On the device front, there is a shifting emphasis towards lower-cost Smartphones in line with the projected growth of emerging countries. As a result, entry-level and mid-range categories will experience significantly higher growth in unit shipments as compared to the higher-end devices popular in operator-subsidized regions. Increasing competition in higher-end devices is also driving above average ASP declines in developed regions.

In ’09, the Smartphone market defied the global recession reaching $67 billion dollars and 171 million units, registering an 18% YoY growth. The Smartphone market is forecast to continue demonstrating strong growth and is forecast to reach 496 million units in 2014 for a 24% compound annual growth rate.

Forward Concepts is pleased to present this extensive (470-page) market study on all aspects of the Smartphone market and the integrated circuits that enable them.

Estimated shipments by each Smartphone vendor for 2008 and 2009 are provided along with of geographical shipment breakouts for many of the major vendors. Detailed Smartphone shipments for each global region are provided by air interface and operating system are also included.

Chip shipments for all major categories are provided, including basebands, RF transceivers, and application processors along with ancillary chips like Wi-Fi, Bluetooth, GPS, FM, image sensors, etc., with vendor market shares and forecasts for each chip type through 2014. Volatile and non-volatile memories and Smartphone displays are also covered in the report.

The complete market and vendor coverage is detailed in the table of contents.

AUTHORS

Satish Menon is a co-author of this report and an independent consultant and Forward Concepts Senior Analyst specializing in communications electronics. Most recently, Satish was Chief Technology Officer for a facilities-based provider of wholesale and retail voice telecommunication services where he architected a distributed, high-availability voice network that unified several circuit-based and packet-based protocols into a single packet-core network based on SIP protocol.  Prior to this, he was founder and VP Product Development for Nuntius Systems, Inc. where he was responsible for all engineering activities that included activities involving voice codecs, GSM/GPRS/EDGE baseband/MAC, DSP based lower-power WLAN baseband/MAC and multimedia codecs. Mr. Menon led a multi-disciplinary team of over 120 engineers and was responsible for building several successful products from concept to completion, over a seven year period.  His background includes product management in areas of wireless technology and platforms, real-time embedded systems, DSP implementations of wired/wireless technology and communication protocol stacks along with product positioning and strategic planning expertise. Mr. Menon has also consulted with several high-tech companies in the areas of communication and multimedia technology. He earned his Bachelor’s degree in Electronics and Communication Engineering from REC, Trichy, India and his Master’s degree in Computer Engineering from University of Southern California.

Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is also a co-author of this report.  Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning.  He was formerly Division Planner for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager for Rockwell’s Semiconductor Products Division.  Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and high-speed modem chip market.  He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations.  Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

Size
470 Pages, 50 Figures, 133 Tables, plus Appendix

Price
Hard Copy (B&W):
North American Price: $3,750.00
Additional copies: $500 ea.
International Price: $3,850.00
Additional copies: $600 ea.

(Air courier shipment included with all hard copies)

Electronic (pdf):
Enterprise License: $7,500.00 (worldwide)

Under the Enterprise License, the report is provided in electronic form (PDF), with the right to distribute to the purchasing organization’s employees, worldwide.

In addition, the PDF file includes a bonus 70-page Appendix covering an overview of 3GPP standards, 3G+ market drivers, mobile Internet and multimedia software.